| TR-5917A Conductor TR-5917A為一種無鉛銀鈀膠，主要應用于晶片電阻器。利用先進的金屬粉末技術與熔塊混合系統(tǒng)，產出優(yōu)質的黏著特性。 | |
| 特性FEATURES | |
| 金屬組成 (Metal Alloy) | 99.5 Ag / 0.5 Pd |
| 金屬含量 (Target Metal Content) | 72.50% |
| 固體含量 (Solid Content) | 77% ± 2% |
| 推薦工藝RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 325 mesh stainless steel screen |
| 干燥燥 (Drying) | 150℃,3 min |
| 燒成 (Firing) | 850℃,8~10 min (for peak-temperature) |
| 總共燒成時間45~60 min | |
| 黏度 (Viscosity) | 220± 20k cps. |
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| 稀釋劑 (Thinner) | T-307 |
| 存儲時間 (Shelf life) | 6 months in sealed container (20℃ ± 5℃) |
| 備注 (Remark) | 實際規(guī)格以產品承認書為主 |
| TR-5917B1 Conductor | |
| TR-5917B1為一種無鉛銀鈀混合物，主要運用于低溫系數晶片電阻器。利用銀粉以特殊熔塊系統(tǒng)產出膠膜，于熔燒及電鍍后產出其優(yōu)質黏著特性。 | |
| 特征 FEATURES | |
| 金屬組成 (Metal Alloy) | 99.5 Ag / 0.5 Pd |
| 金屬含量 (Target Metal Content) | 72.5% ± 2% |
| 固體含量 (Solid Content) | 78.2% ± 2% |
| 推薦工藝RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 325 mesh stainless steel screen |
| 干燥 (Drying) | 150℃,3~5 min |
| 燒成 (Firing) | 850℃,8~10 min (for peak-temperature) |
| 總共燒成時間35~45 min | |
| 黏度 (Viscosity) | 200~240k cps. |
| (Brookfield, HBT DV-E, SC4-14 | |
| 10rpm at 25℃) | |
| 稀釋劑 (Thinner) | T-301 |
| 儲存時間 (Shelf life) | 6 months in sealed container (5℃~30℃) |
| 備注 (Remark) | 實際規(guī)格以產品承認書為主 |
| TR-5932S Conductor | |
| TR-5932S為一種無鉛純銀導電膠，主要運用于小尺寸晶片電阻器。它利用銀粉以特殊熔塊系統(tǒng)產出優(yōu)質黏性以及抵抗氧化鋁基板上的酸性特性。 | |
| 特征FEATURES | |
| 金屬組成 (Metal Alloy) | 100% Ag |
| 金屬含量 (Target Metal Content) | 55% |
| 固體含量 (Solid Content) | 59.5% ± 2% |
| 推薦工藝RECOMMENDED PROCESSING | |
| 印 刷 (Printing) | 400 mesh stainless steel screen |
| 干燥 (Drying) | 150℃,3 min |
| 燒成 (Firing) | 850℃,10~12 min (for peak-temperature) |
| 總共燒成時間45~60 min | |
| 黏度 (Viscosity) | 180 ± 20k cps. |
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| 稀釋劑 (Thinner) | T-301 |
| 儲存時間 (Shelf life) | 6 months in sealed container (5 ~ 30℃) |
| 備注(Remark) | 實際規(guī)格以產品承認書為主 |
立承德（ NEXTECK ）的各項產品都獲得長年的實積和信賴。用于半導體及電子零件的各種牌號非常齊全，對應各式各樣的成形方法，具有良好的成形性與尺寸精確度。